Multi-dispensing 방법을 이용한 임프린트 레진의 균일도 향상 연구

Abstract

With the development of the integrated circuit technology for electronic devices,the fabrication of high-performance devices using nanostructures is gaining importance in the semiconductor manufacturing industry. The imprint method is a promising approach for fabricating nanostructures at a low cost and high processing volume. The nano-imprint lithography (NIL) method is widely used to fabricate devices. It includes thermal-NIL and UV-NIL, and it is performed using resins. This study examined the effect of the resin application method on the pattern transferred to a substrate. In NIL, a resin is generally applied via spin coating and dispensing. Spin coating is suitable for controlling the thickness of the resin. However, the surplus resin is discarded. Dispensing can adjust the amount of resin to be applied, thereby reducing wastage. Spin coating can be used in single-step and step-repeat processes, but dispensing can only be used in step-repeat processes. In a single-step process, a stamp pattern is transferred to a substrate at once. In a step-repeat process, a large wafer pattern is repeatedly transferred to a small stamp with a thickness of less than 1 inch. We divided a square glass substrate with a side length of 7.5 cm into unit regions of 3 × 3, 4 × 4, 5 × 5, and 6 × 6. Then, a resin was dispensed in each unit region, followed by spin coating according to the conditions. Thereafter, a pattern was transferred using a single-step process. After measuring the parameters of the transferred pattern, the uniformity was calculated to confirm the best conditions for obtaining an excellent pattern, and the validity of the imprint process was confirmed. It is expected that the method confirmed in this study will contribute to electronic material fabrication in the future as a high-quality cost-effective pattern production method.