Detailed Information
Metadata Downloads
DBM 공정에 의해 제조된 무연 솔더볼의 미세조직 관찰에 관한 연구
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 박환녕 | - |
| dc.date.accessioned | 2017-02-22T02:18:59Z | - |
| dc.date.available | 2017-02-22T02:18:59Z | - |
| dc.date.issued | 2003 | - |
| dc.date.submitted | 2005-10-19 | - |
| dc.identifier.uri | http://kmou.dcollection.net/jsp/common/DcLoOrgPer.jsp?sItemId=000002173737 | ko_KR |
| dc.identifier.uri | http://repository.kmou.ac.kr/handle/2014.oak/8197 | - |
| dc.description.abstract | The uniform droplets for lead-free solder balls fabricated by using the Droplet-Based Manufacturing(DBM) process. The DBM process generates uniform droplet from molten metal jets by the uniform vibration of the piezoelectric materials, and consists of a crucible, an orifice, a spray chamber system, a gas control system, a melt vibration system, a charging system, and a video monitoring system. The Sn-Pb eutentic solder balls use make of the most widly in chip-packing technique. However the use of Pb have been resricted due to environment and toxicologic. Therefore lead-free solder alloys to make investigate Sn, Sn-3.5wt%Ag, Sn-3.8wt%Ag-0.6wt%Zn materials. In order to observe the morphology and microstructure of the droplets, lead-free solder balls were collected at different levels of flight distance of 0.15m, 0.30m, 0.50m, and 0.65m, respectively. The collected solder balls were characterized by use of SEM, OM, AES, and XPS. The sphericity of droplets decreased with increasing the flight distance due to oxidation effect of droplet surface. The microstructure of droplets changed from cell structure to dendrite structure with increasing orifice size due to effect of cooling effect. The microstructure of droplets showed that the arm spacing of dendrite increased with increasing the flight distance. | - |
| dc.description.tableofcontents | 목차 제1장 서론 = 5 제2장 이론적 배경 = 7 2.1 DBM(Droplet-Based Manufacturing) 공정 = 7 2.1.1 DBM(Droplet-Based Manufacturing)공정 원리 = 7 2.1.2 DBM 공정장비의 개요 = 7 2.1.3 DBM장비의 구성요소 = 8 2.1.4 DBM 공정의 응용분야 = 14 2.2 Droplet의 응고(Solidification of Droplet) = 16 2.2.1 Simulation of Droplet = 18 2.2.2 수지상 응고 (Dendrite solidification) = 19 2.2.3 수축공의 생성 = 22 2.3 무연솔더 (Lead-Free Solder) = 23 2.3.1 무연솔더의 개발동향 = 23 2.3.2 무연솔더의 종류와 특징 = 24 제3장 실험 방법 = 27 3.1 모합금의 선택 및 제조 = 27 3.2 실험장비와 과정 = 27 3.3 Droplet의 분석 = 28 제4장 실험 결과 및 고찰 = 31 4.1 Droplet의 구형도 = 31 4.1.1 산화피막의 형성 = 31 4.1.1.1 AES (Auger Electron Spectroscopy) = 32 4.1.1.2 XPS (X-ray Photoelectron Spectroscopy) = 40 4.1.1.3 산화피막의 형성에 의한 구형도의 저하 = 41 4.1.2 응고 수축 = 44 4.2 Droplet의 미세조직 = 46 4.2.1 Sn-3.5wt%Ag = 49 4.2.2 Sn-3.8wt%Ag-0.6wt%Zn = 56 제5장 결론 = 62 참고문헌 = 63 Abstract = 66 | - |
| dc.publisher | 한국해양대학교 대학원 | - |
| dc.title | DBM 공정에 의해 제조된 무연 솔더볼의 미세조직 관찰에 관한 연구 | - |
| dc.title.alternative | A Study on the Microstructure of Lead-Free Solder Balls Fabricated by Droplet-Based Manufacturing Process | - |
| dc.type | Thesis | - |
- Files in This Item:
- 000002173737.pdf Download
Items in Repository are protected by copyright, with all rights reserved, unless otherwise indicated.